Integrated fan-out package and method of fabricating the same

An integrated fan-out package, comprising:

• a die;
• a first redistribution circuit structure, over a back surface of the die;
• a second redistribution circuit structure, over an active surface of the die;
• an insulating encapsulation, aside the die to encapsulate the die and a plurality of sidewalls of first redistribution conductive layers of the first redistribution circuit structure;
• a plurality of conductive structures, penetrating the insulating encapsulation, wherein at least one of the conductive structures comprises:
• a first portion electrically connected to the first redistribution circuit structure;
• and
• a second portion on the first portion and electrically connected to the second redistribution circuit structure, and electrically connected to the first redistribution circuit structure through the first portion, wherein a material of the first portion and a material of the second portion are different, and an upper surface of the second portion is partially covered by a bottommost dielectric layer of the second redistribution circuit structure;
• a plurality of first conductive terminals electrically connected to the second redistribution circuit structure;
• and
• a plurality of second conductive terminals electrically connected to the first redistribution circuit structure.

A fabricating method of an integrated fan-out package, the fabricating method comprising:

• forming a first redistribution circuit structure on a carrier, wherein the first redistribution circuit structure comprises a first dielectric layer and a plurality of first redistribution conductive layers on the first dielectric layer;
• forming a plurality of solder joints on a portion of the first redistribution conductive layers;
• mounting a plurality of conductive posts on the first redistribution conductive layers through the solder joints respectively;
• mounting a die on another portion of the first redistribution conductive layers by an adhesive;
• forming an insulating encapsulation to encapsulate a plurality of sidewalls of the die, a plurality of sidewalls of the conductive posts, the plurality of sidewalls of the first redistribution conductive layers, and a plurality of sidewalls of the solder joints;
• forming a second redistribution circuit structure on the insulating encapsulation, the die, and the conductive posts, wherein the second redistribution circuit structure is electrically connected to the die and the conductive posts, and upper surfaces of the conductive posts are partially covered by a bottommost dielectric layer of the second redistribution circuit structure;
• and
• removing the carrier.