WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method Therefor

A method of fabricating a quad flat no lead package comprising:

• providing a leadframe having at least one recess formed in a top surface of a die paddle portion of said leadframe;
• embedding at least one first integrated circuit die in said at least one recess;
• forming solder bumps on said at least one first integrated circuit die;
• forming copper pillars on said leadframe and on leads of said leadframe;
• dispensing an underfill material surrounding said solder bumps and said copper pillars on said die paddle portion of said leadframe;
• and
• thereafter flip chip attaching a second integrated circuit die to said at least one first integrated circuit die, wherein said first and second integrated circuit dies are electrically connected through said solder bumps and wherein said second integrated circuit die is electrically connected to said die paddle portion of said leadframe and to said leads through said copper pillars and wherein a thickness of said at least one first integrated circuit die does not contribute to a thickness of completed said quad flat no lead package.