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US 2018/0025963 A1Published application
Method, system, and electronic assembly for thermal management
AssigneeGE Energy Power Conversion Technology Limited
InventorZane Taylor Miller
Life of this patent
Estimating the term…
Abstract
There are provided methods, systems, and electronic assemblies for efficient thermal management in electronics applications. For example, there is provided an electronic assembly that includes a thermal management system that can include a heat sink having electronic components mounted thereon. The electronic components can be mounted on the heat sink in a staggered pattern along a centerline substantially perpendicular to a direction of flow of a coolant.
Claims20
An electronic assembly, comprising:
- a thermal management system including:
- a heat sink having a plurality of dies mounted thereon in a staggered pattern along
- a centerline substantially perpendicular to a direction of flow of a coolant.
(canceled)
An electronic assembly, comprising:
- a thermal management system including:
- a heat sink having a plurality of electronic components mounted thereon in a staggered pattern along a centerline substantially perpendicular to a direction of flow of a coolant.
A method for use with an electronic assembly, comprising:
- mounting a plurality of electronic components on a heat sink in a staggered pattern along a centerline of a heat sink, the centerline being in a direction substantially perpendicular to a flow direction of a coolant of the heat sink.
Dependencies are inferred from the claim text.