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US 2018/0025960 A1Published application
Circuit package
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W Cumbie
Life of this patent
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Abstract
A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.
Claims14
A circuit package panel comprising
- a front and back face,
- a packaging of epoxy mold compounds, and
- a circuit device in the packaging, wherein
- the packaging comprises, parallel to the front face, at least one hybrid layer of a first epoxy mold compound and next to it a second epoxy mold compound of a different composition.
1 more element
The circuit package of claim 4 wherein the first compound extends under the circuit device and under the second compound.
A method of compression molding a circuit package, comprising
- depositing on a carrier a first epoxy mold compound and a second epoxy mold compound each of a different composition,
- heating the epoxy mold compounds,
- providing a circuit device in the first epoxy mold compound, and
- compressing the epoxy mold compounds so that both epoxy mold compounds extend in one hybrid layer.
1 more element
A circuit package, comprising
- a packaging formed of a plurality of different epoxy mold compounds, the packaging having a front face;
- and
- a circuit device disposed in the packaging near the front face;
- said plurality of epoxy mold compounds comprising, parallel to the front face, at least one hybrid layer of
- a bulk epoxy mold compound, and
- a second epoxy mold compound of a different composition than the bulk epoxy mold compound, next to the bulk epoxy mold compound.
3 more elements
Dependencies are inferred from the claim text.