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US 2018/0025959 A1Published application
Integrated Circuit Packages and Methods for Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo
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Abstract
A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.
Claims20
A chip comprising:
- a substrate;
- a metal pad over the substrate;
- a passivation layer having a portion over the metal pad;
- a polymer layer over the passivation layer, wherein the polymer layer extends to an edge of the chip, and a first edge of the polymer layer forms a part of the edge of the chip;
- an electrical connector;
- and
- a molding compound encircling a portion of the electrical connector, wherein a lower portion of the electrical connector is in the molding compound, and wherein the molding compound comprises a surface comprising:
- a first horizontal surface substantially perpendicular to the edge of the chip;
- and
- a slant sidewall surface, wherein the first horizontal surface is connected to a first end of the slant sidewall surface, and the slant sidewall surface is neither perpendicular to nor parallel to the edge of the chip.
7 more elements
A chip comprising:
- a metallic feature adjacent to an edge of the chip;
- a solder region;
- and
- an encapsulating material encapsulating a lower portion of the solder region therein, wherein an upper portion of the solder region protrudes higher than first top surfaces of the encapsulating material, and wherein the encapsulating material comprises:
- a first surface;
- a sidewall surface;
- and
- a second surface extending to the edge of the chip, wherein the first surface, the sidewall surface, and the second surface form a step, and the first surface and the second surface are substantially parallel to each other.
5 more elements
A chip comprising:
- a seal ring proximal a peripheral of the chip;
- a polymer layer over the seal ring;
- and
- an encapsulating material over the polymer layer, wherein each of the polymer layer and the encapsulating material comprises a first portion directly over the seal ring, and the first portions of the polymer layer and the encapsulating material in combination are at least partially transparent to allow the seal ring to be visible.
1 more element
Dependencies are inferred from the claim text.