Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus

Abstract

A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient α1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient α2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient α3 of the base satisfy both of the following formula (1) and (2); α1<α3<α2   (1) −2<α1+α2−2α3<2   (2) wherein the unit of the linear expansion coefficient is ppm/K. The base-attached encapsulant for semiconductor encapsulation which suppress package warpage even if a package with a large area is encapsulated.

Dependencies are inferred from the claim text.