Polyphenylene sulfide resin composition, molded product formed therefrom and method of producing semiconductor package

Abstract

A polyphenylene sulfide resin composition includes 5-50% by weight of (A) a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10000 and a polydispersity, which is expressed by dividing the weight-average molecular weight by a number-average molecular weight, of not higher than 2.5; and 95-50% by weight of (B) fused silica in a spherical form having a volume-average particle diameter of not less than 0.1 μm and less than 1.0 μm, wherein a total of (A) and (B) is kept at 100% by weight.

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