Semiconductor device and method
AssigneeChip Solutions, LLC
InventorSukianto Rusli
Life of this patent
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Abstract
Disclosed herein is a method for forming a semiconductor package. The method includes providing a first releasable chip carrier attached to a conductive layer. A circuit layer is formed on a surface of the conductive layer and a dielectric layer is applied over a surface of the circuit layer. A second releasable chip carrier is attached to a surface of the dielectric layer and the first releasable chip carrier is released from the conductive layer via facilitation of a first activating source. The circuitry of the circuit layer is operationally tested.
Claims20
A method for forming a semiconductor package comprising:
- providing a first releasable chip carrier attached to a conductive layer;
- forming a circuit layer on a surface of the conductive layer;
- applying a dielectric layer over a surface of the circuit layer;
- attaching a second releasable chip carrier to a surface of the dielectric layer;
- releasing, via facilitation of a first activating source, the first releasable chip carrier from the conductive layer;
- and
- operationally testing circuitry of the circuit layer.
A method for forming semiconductor packages comprising:
- providing a first releasable chip carrier attached to a conductive layer;
- forming a circuit layer on a surface of the conductive layer;
- applying a dielectric layer over a surface of the circuit layer;
- attaching a second releasable chip carrier to a surface of the dielectric layer;
- releasing, via facilitation of a first activating source, the first releasable chip carrier from the conductive layer;
- and
- operationally testing first circuitry and second circuitry of the circuit layer.
A releasable carrier structure comprising:
- a first releasable chip carrier;
- a carrier conductive layer;
- a first releasable tape layer placed between the first releasable chip carrier and the carrier conductive layer, wherein the first releasable tape layer attaches the first releasable chip carrier to the carrier conductive layer, and wherein the first releasable tape layer is configured to release the first releasable chip carrier from the carrier conductive layer after being exposed to an activating source;
- a dielectric layer formed over a surface of a circuit layer formed over the carrier conductive layer;
- a second releasable chip carrier;
- and
- a second releasable tape layer placed between the second releasable chip carrier and the dielectric layer, wherein the second releasable tape layer attaches the second releasable chip carrier to the dielectric layer, and wherein the second releasable tape layer is configured to release the second releasable chip carrier from the dielectric layer after being exposed to the activating source.
Dependencies are inferred from the claim text.