Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing
AssigneeApplied Materials, Inc.
InventorKadthala R. Narendrnath
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Abstract
A laminated top plate of a workpiece carrier is described that is particularly suitable for mechanical and semiconductor processing. In one example, A method of fabricating a workpiece carrier top plate includes dispensing conductive paste onto at least one of a plurality of ceramic sheets, embedding the paste between the plurality of ceramic sheets, compacting ceramic sheets together with the paste, and sintering the paste.
Claims20
A method of fabricating a workpiece carrier top plate comprising:
- dispensing conductive paste onto at least one of a plurality of ceramic sheets;
- embedding the paste between the plurality of ceramic sheets;
- compacting ceramic sheets together with the paste;
- and
- sintering the paste.
A workpiece carrier top plate for carrying a semiconductor substrate, the carrier comprising:
- a plurality of ceramic sheets compacted together;
- sintered conductive paste dispensed onto the ceramic sheets and embedded between the ceramic sheets;
- and
- electrical terminals coupled to the conductive paste to apply an electrical current to the conductive paste.
A method of forming a top plate for a workpiece carrier comprising:
- embossing a pattern of wells into a ceramic sheet;
- applying a conductive paste into the wells of the ceramic sheet;
- drying the paste;
- and
- compacting the ceramic sheet with a plurality of other ceramic sheets to form the top plate.
Dependencies are inferred from the claim text.