Precleaning Apparatus and Substrate Processing System

A substrate processing system comprising:

• a load-lock chamber having an internal space configured to accommodate a substrate and to allow a pressure reduction therein;
• a transfer chamber connected to the internal space of the load-lock chamber and including a transfer robot configured to transport the substrate;
• a cleaning chamber adjacent the transfer chamber and configured to clean the substrate transported from the transfer chamber by the transfer robot;
• and
• a plurality of process chambers adjacent the transfer chamber and configured to process the substrate transported from the transfer chamber by the transfer robot,
• wherein a plasma generation unit configured to generate plasma gas and a heating unit configured to heat the substrate are disposed in an internal space of the cleaning chamber, and
• the substrate processing system further comprises a cleaning gas supply unit configured to supply gas for oxide etching to the internal space of the cleaning chamber and a hydrogen gas supply unit configured to supply hydrogen gas to the internal space of the cleaning chamber.

A precleaning apparatus comprising:

• a chamber;
• a substrate support in an internal space of the chamber and configured to support a substrate having a contaminated or damaged portion;
• a heating unit configured to heat the substrate on the substrate support;
• a hydrogen gas supply unit configured to supply hydrogen gas to the internal space of the chamber to heat-treat the heated substrate;
• a plasma generation unit disposed in the chamber and configured to generate plasma gas;
• a cleaning gas supply unit configured to supply gas to the internal space of the chamber to remove an oxide from the contaminated or damaged portion of the substrate using plasma etching;
• and
• a halogen gas supply unit configured to supply halogen gas to the internal space of the chamber to remove a surface layer of the contaminated or damaged portion of the substrate.