Power electronic switching device, arrangement herewith and methods for producing the switching device

A power electronic switching device (1), comprising:

• a substrate (2), comprising a connection device (3);
• a pressure device (5);
• the substrate (2) has a plurality of conductor tracks (22) electrically insulated from one another;
• a power semiconductor component (7) with a first semiconductor main surface (70) is arranged on one of a plurality of conductor tracks (22) and is electrically conductively connected to said one of said conductor tracks (22);
• the connection device (3) is embodied as a film composite;
• said film composite includes at least one electrically conductive film (30, 34) and an electrically insulating film (32) and forms a first film composite main surface (300) opposite a second film composite main surface (340);
• the switching device is connected in a circuit-conforming manner internally by means of the connection device (3) and a second semiconductor contact area (720) of a second semiconductor main surface (72) of the power semiconductor component (7) is connected to a first film contact area (304) of the first film composite main surface (300) of the connection device (3) in a force-locking and an electrically conductive manner;
• a pressure device (5) has a pressure body (50) and a pressure element (52) projecting therefrom in a direction of the power semiconductor component (7);
• the pressure element (52) pressing a first film section (344) of the second film composite main surface (340) of the film composite (3);
• and
• wherein, said first film section (344) is arranged within an area (74) of the power semiconductor component (7) in a projection along a direction that is normal (N) to the power semi-conductor component (7).