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AssigneeSAE Magnetics (H.K.) Ltd.
InventorsRyuji FUJII, Shi Xiong CHEN, Long Ping WANG, Zeng Hui ZHANG
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A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.
A row bar for forming magnetic heads, comprising a row of magnetic head forming portions each of which has a magnetic head to be cut from the row bar and a cutting portion adjacent to the magnetic head, a row of bonding pads and a first electrical lapping guide pad being provided at the magnetic head, a second electrical lapping guide pad being provided at the cutting portion, both of the first and the second electrical lapping guide pads being adapted for contacting with a probe during lapping process, wherein a conductive structure that is higher than surfaces of the first and the second electrical lapping guide pads is formed at peripheries of the first and the second electrical lapping guide pads respectively.
A wafer for forming magnetic heads, comprising multiple row bars each of which comprises a row of magnetic head forming portions, each magnetic head forming portion having a magnetic head to be cut from the row bar and a cutting portion adjacent to the magnetic head, a row of bonding pads and a first electrical lapping guide pad being provided at the magnetic head, a second electrical lapping guide pad being provided at the cutting portion, both of the first and the second electrical lapping guide pads being adapted for contacting with a probe during lapping process, wherein a conductive structure that is higher than surfaces of the first and the second electrical lapping guide pads is formed at peripheries of the first and the second electrical lapping guide pads respectively.
Dependencies are inferred from the claim text.