Methods of detecting faults in real-time for semiconductor wafers
AssigneeGlobalfoundries Inc.
InventorsRobert Boyd FINLAY, Yunsheng SONG
Life of this patent
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AssigneeGlobalfoundries Inc.
InventorsRobert Boyd FINLAY, Yunsheng SONG
Estimating the term…
Systems for and methods of detecting faults in semiconductor wafers are provided. One method includes, for instance: monitoring, with at least one sensor, a recipe for manufacturing a semiconductor wafer; tracking, with a fault detection system, a set of steps for the recipe; determining a start of a step; sensing a set of data related to at least one parameter of the step; generating, by an imaging system, an image of the set of data; displaying, on a display, the image of the set of data; calculating, by the fault detection system, a pixel area ratio from the image of the set of data; determining if a fault exists in the wafer based upon the pixel area ratio; and displaying, on the display, an indication of the fault during real-time and at an end of the step.
A method of detecting faults in a semiconductor wafer, the method comprising:
A system for detecting faults in a semiconductor wafer utilizing a method, the method comprising:
Dependencies are inferred from the claim text.