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US 2018/0024430 A1Published application
Polymer and positive resist composition
AssigneeZeon Corporation
InventorManabu HOSHINO
Life of this patent
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Abstract
Provided are a polymer that can be favorably used as a positive resist having a low film reduction rate in a state of low irradiation with ionizing radiation or the like and a positive resist composition that can favorably form a high-resolution pattern. The polymer includes an α-methylstyrene unit and a methyl α-chloroacrylate unit, and the proportion of components having a molecular weight of less than 6,000 in the polymer is no greater than 0.5%. The positive resist composition contains the aforementioned polymer and a solvent.
Claims5
A polymer comprising an α-methylstyrene unit and a methyl α-chloroacrylate unit, wherein
- a proportion of components having a molecular weight of less than 6,000 is no greater than 0.5%.
Dependencies are inferred from the claim text.