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US 2018/0024304 A1Published application
Methods and systems for hermetically sealed fiber to chip connections
AssigneeMicron Technology, Inc.
InventorsRoy Meade, Gurtej Sandhu
Life of this patent
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Abstract
Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.
Claims17
An optical device, comprising:
- a photonic-integrated chip on which an optical waveguide is formed, the photonic-integrated chip having a flat base surface;
- and
- an optical fiber assembly comprising an optical fiber having a flat terminating end surface that is pre-activated in a plasma to create dangling bonds on the terminating end surface of the optical fiber which facilitate coupling with the optical waveguide,
- wherein the terminating end surface of the optical fiber directly contacts the base surface of the photonic-integrated chip, thereby providing a hermetically sealed optical connection to the optical waveguide formed in the photonic-integrated chip.
1 more element
An optical device, comprising:
- a photonic-integrated chip on which an optical waveguide is formed;
- and
- an optical fiber assembly comprising an optical fiber having a self-aligned mechanical interface that is pre-activated in a plasma to create dangling bonds on the self-aligned mechanical interface of the optical fiber which facilitate coupling with the optical waveguide,
- wherein the self-aligned mechanical interface of the optical fiber provides a hermetically sealed optical connection to the optical waveguide formed in the photonic-integrated chip.
1 more element
Dependencies are inferred from the claim text.