High volume system level testing of devices with pop structures

A method for testing devices with POP structures attached, comprising:

• installing devices into a plurality of sockets found on a test interface board (TIB);
• loading package-on-package (POP) devices onto floating nests located in a POP array, the POP array located above the (TIB), one floating nest being associated with each of the plurality of sockets;
• aligning each one of the floating nests to their respective devices found in the sockets;
• and
• presenting the floating nests to their respective devices so that each of the POP devices make electrical interconnection with their respective device.

An above test interface board package-on-package (POP) array, comprising:

• a floating nest capable of moving in the X, Y and z axes;
• a device-under-test (DUT) contactor array including a plurality of interconnection pins extending from a top and bottom surface of the DUT contactor array, the DUT contactor array located inside of the first floating nest;
• and
• a printed circuit board (PCB) fixed to the floating nest and having electrically conductive pads on first and second major surfaces, the electrically conductive pads on the first major surface for receiving the plurality of interconnection pins from the DUT contactor array's top surface;
• and
• a memory integrated circuit coupled to the electrically conductive pads on the second major surface of the PCB.