Internal temperature measuring apparatus and sensor package

An internal temperature measuring apparatus that measures an internal temperature of a measurement object, the internal temperature measuring apparatus comprising:

• a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip comprising one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip;
• and
• a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package,
• wherein an outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.