Polysiloxane formulations and coatings for optoelectronic applications

A crosslinkable composition, comprising:

• a first silicon-containing resin comprising alkyl groups and aryl groups, wherein the first silicon-containing resin having a weight average molecular weight from 1000 AMU to 10,000 AMU;
• second silicon-containing resin comprising aryl groups, wherein the second silicon-containing resin having a weight average molecular weight from 900 AMU to 5000 AMU;
• at least one solvent;
• and
• at least one heat-activated catalyst.

A method of forming a composition, the method comprising:

• combining a first siloxane resin comprising alkyl groups and aryl groups, a second siloxane resin comprising aryl groups, a solvent, and a heat activated catalyst to form a crosslinkable composition, wherein the first silicon-containing resin having a weight average molecular weight from 1000 AMU to 10,000 AMU and the second silicon-containing resin having a weight average molecular weight from 900 AMU to 5000 AMU;
• depositing the composition on a substrate;
• and
• curing the crosslinkable composition at a temperature of 350° C. or greater to form a crosslinked film, wherein the crosslinked film has a thickness of 1.5 μm or greater.