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US 2018/0022875 A1Published application
Composition and polyamideimide composite and polyamideimide film and electronic device
AssigneesSamsung Electronics Co., Ltd., Samsung SDI Co., Ltd.
InventorsSungwon CHOI, Chanjae AHN, Hyunjeong JEON, Sang Soo JEE, Byunghee SOHN, Won Suk CHANG
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Abstract
A composition including a polyamideimide precursor modified with an alkoxysilane group and an oligosilica compound, wherein the oligosilica compound is a condensation reaction product of an organosilane diol and an alkoxysilane compound.
Claims22
A composition comprising:
- a polyamideimide precursor modified with an alkoxysilane group and an oligosilica compound,
- wherein the oligosilica compound is a condensation product of an organosilane diol and an alkoxysilane compound.
A method of manufacturing a polyamideimide film, comprising:
- preparing a polyamideimide precursor,
- reacting the polyamideimide precursor with a reactive organosilane compound to prepare a polyamideimide precursor modified with an alkoxysilane group,
- preparing an oligosilica compound through a non-hydrolytic condensation reaction of the organosilane diol and an alkoxysilane compound,
- mixing the polyamideimide precursor modified with an alkoxysilane group with the oligosilica compound, and
- curing the mixture.
2 more elements
Dependencies are inferred from the claim text.