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US 2018/0022601 A1Published application
Method for producing a semiconductor module
AssigneeInfineon Technologies AG
InventorsClaus Waechter, Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier
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Abstract
The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
Claims21
A method for producing a semiconductor module, the method comprising:
- fabricating a semiconductor panel comprising a plurality of semiconductor devices;
- fabricating a cap panel comprising a plurality of caps;
- bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices;
- and
- singulating the bonded panels into a plurality of semiconductor modules.
2 more elements
A semiconductor module, comprising:
- a semiconductor device;
- and
- a cap disposed above the semiconductor device;
- wherein the semiconductor module is fabricated by bonding a cap panel comprising a plurality of caps onto a semiconductor panel comprising a plurality of semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.
1 more element
A packaged MEMS device, comprising:
- an embedding arrangement;
- a MEMS device disposed in the embedding arrangement;
- a cap disposed above the MEMS device;
- wherein the packaged MEMS device is fabricated by bonding a cap panel comprising a plurality of caps onto a MEMS panel comprising a plurality of MEMS devices, and singulating the bonded panels into a plurality of packaged MEMS devices.
1 more element
Dependencies are inferred from the claim text.