Signal pin arrangement for multi-device power module

A phase leg for an inverter in an electric vehicle, comprising:

• a first insulating substrate having a bonded copper layer on a first side defining circuit traces, a plurality of first signal pins, and a plurality of power terminals, wherein the first signal pins and power terminal are coplanar and each cantilevers beyond an edge of the first substrate;
• a plurality of semiconductor chips each containing a respective power transistor and having a respective side soldered to a respective circuit trace on the first substrate that extends to one of the power terminals;
• a second insulating substrate parallel to the first substrate and having a bonded copper layer on an interior side facing the first side and defining circuit traces and a plurality of second signal pins, wherein the second signal pins are coplanar and each cantilevers beyond an edge of the second substrate, wherein the circuit traces connect respective power transistors in series with an intermediate junction providing a phase leg output, wherein each chip includes a plurality of signal pads, wherein a first group of the signal pads of each power transistor are each connected to a respective first signal pin, and wherein a second group of the signal pads of each power transistor are each connected to a respective second signal pin;
• a plurality of spacers each soldered between the first side and the interior side;
• and
• an encapsulating body securing the substrates, chips, and spacers, wherein the signal pins and power terminals extend through the encapsulating body.

A power module comprising:

• a pair of spaced apart substrates having circuit traces connecting a plurality of signal pins and power terminals respectively thereon and coplanarly cantilevered beyond edges of the substrates;
• at least one semiconductor chip attached to a circuit trace on one of the substrates;
• a plurality of spacers between the substrates;
• and
• an encapsulating body;
• wherein spacing of paired signal pins and spacing of paired power terminals are transverse for magnetic decoupling.