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US 2018/0022093 A1Published application
MEMS Jetting Structure For Dense Packing
AssigneeFUJIFILM Dimatix, Inc.
InventorsAndreas Bibl, Kevin von Essen, Paul A. Hoisington
Life of this patent
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Abstract
A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
Claims2
A fluid ejector, comprising:
- a fluid ejection module comprising a substrate having a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle;
- and
- a layer separate from the substrate comprising a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
2-35. (canceled)
Dependencies are inferred from the claim text.