Method and device for detaching a substrate from a substrate stack
AssigneeEV Group E. Thallner GmbH
InventorJurgen BURGGRAF
Life of this patent
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Abstract
A method and device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate and a product substrate, as well as a bonding layer bonding the carrier substrate and the product substrate. The bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, and the adhesive strength is at least partially reduced by a beam of electromagnetic radiation directed at least predominantly on the bonding layer.
Claims15
1-9. (canceled)
A method for detaching a carrier substrate from a substrate stack that is comprised of the carrier substrate, a product substrate, and a bonding layer that bonds the carrier substrate and the product substrate, wherein the bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, said method comprising:
- directing a beam of electromagnetic radiation on the bonding layer to at least partially reduce said adhesive strength, wherein the electromagnetic radiation is a laser beam that is focused directly onto the bonding layer.
A device for detaching a carrier substrate from a substrate stack, which is formed by the carrier substrate, a product substrate, and a bonding layer that bonds the carrier substrate and the product substrate, wherein the bonding layer has an adhesive strength for bonding the carrier substrate and the product substrate, the device comprising:
- a source for emitting a beam of electromagnetic radiation, the beam of electromagnetic radiation being a laser beam, wherein the adhesive strength is at least partially reduced by directing the laser beam on the bonding layer;
- and
- a focusing device for focusing the laser beam directly on the bonding layer.
Dependencies are inferred from the claim text.