Molding system for applying a uniform clamping pressure onto a substrate

A method for encapsulating electronic devices mounted on a substrate, the method comprising the steps of:

• clamping onto and applying a clamping pressure to the substrate with a first mold chase surface of a first mold chase and a second mold chase surface of a second mold chase that is opposite to the first mold chase surface;
• determining a first relative distance between the substrate and a mold chase facing the substrate with a first sensor located at a first position;
• determining a second relative distance between the substrate and the mold chase facing the substrate with a second sensor located at a second position;
• adjusting the first relative distance with respect to the second relative distance with a first actuator located adjacent to the first position and a second actuator located adjacent to the second position;
• and thereafter
• introducing liquefied molding compound onto the substrate to encapsulate the electronic devices.

The method for encapsulating electronic devices as claimed in claim 16, further comprising the steps of, after introducing liquefied molding compound onto the substrate:

• determining the first relative distance between the substrate and a mold chase facing the substrate with the first sensor;
• determining the second relative distance between the substrate and the mold chase facing the substrate with the second sensor;
• adjusting the first relative distance with respect to the second relative distance with the first and second actuators;
• and
• allowing the liquefied molding compound to cure.