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US 2018/0021896 A1Published application
Lead-free solder composition
AssigneeNational Cheng Kung University
InventorsKwang-Lung LIN, Che-Wei CHANG, Wei-Chih HUANG
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Abstract
A lead-free solder composition includes tin, titanium and zinc. Based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.
Claims4
A lead-free solder composition comprising tin, titanium and zinc,
- wherein, based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.
Dependencies are inferred from the claim text.