Electrocardiogram sensor ring

An electrocardiogram (ECG) sensor comprising:

• a flexible elongated substrate having an inner surface and an outer surface opposite the inner surface, said substrate having a first end and a second end opposite the first end;
• a first connector at the first end of said substrate;
• a second connector at the second end of said substrate, whereby the first and second connectors can be removably engaged and have a first locked position wherein the first and second connectors are locked and the flexible substrate is in a ring shape configured to be worn about a patient's finger, and a second unlocked position wherein the first and second connectors are disengaged and the flexible substrate is in a substantially linear shape configured to conform to the patient's body;
• and
• an ECG electrode positioned at the inner surface of said substrate, whereby the first ECG electrode receives an ECG signal when touched to the patient's body.

An electrocardiogram (ECG) sensor comprising:

• an electronics layer having a first flexible packaging layer with an inner surface;
• a first electronic component having a first conductive contact, said first electronic component embedded in the first flexible packaging layer with at least a portion of the first conductive contact exposed at the inner surface of the first flexible packaging layer;
• a second electronic component having a second conductive contact, said second electronic component embedded in the first flexible packaging layer with at least a portion of the second conductive contact exposed at the inner surface of the first flexible packaging layer, said second electronic component spaced apart from said first electronic component;
• a contact via layer having a second flexible packaging layer positioned over the inner surface of said electronics layer, said contact via layer having a first contact via extending through the second flexible packaging layer and aligned with the first conductive contact, and a second contact via extending through the second flexible packaging layer and aligned with the second conductive contact;
• an interconnect layer having a third flexible packaging layer positioned over said contact via layer, said interconnect layer having an interconnect channel with a first end aligned with and in flow communication with the first contact via and a second end aligned with and in flow communication with the second contact via;
• and
• a conductive material in said first contact via, second contact via and interconnect channel to electrically couple the first conductive contact of the first electronic component with the second conductive contact of the second electronic component.

A method of forming an electrocardiogram (ECG) sensor, the method comprising:

• forming an electronics layer having a first flexible packaging layer with an inner surface;
• embedding a first electronic component having a first conductive contact in the first flexible packaging layer with at least a portion of the first conductive contact exposed at the inner surface of the first flexible packaging layer;
• embedding a second electronic component having a second conductive contact in the first flexible packaging layer with at least a portion of the second conductive contact exposed at the inner surface of the first flexible packaging layer, wherein the second electronic component is spaced apart from said first electronic component;
• forming a contact via layer having a second flexible packaging layer having a first contact via and a second contact via, the first and second contact vias extending through the second flexible packaging layer;
• placing the contact via layer over the inner surface of the electronics layer, wherein the first contact via is aligned with the first conductive contact, and the second contact via is aligned with the second conductive contact;
• forming an interconnect layer having a third flexible packaging layer, wherein the interconnect layer has an elongated interconnect channel with a first end and a second end;
• placing the interconnect layer over the contact via layer with the first end of the interconnect channel aligned with and in flow communication with the first contact via and the second end of the interconnect channel aligned with and in flow communication with the second contact via;
• and
• introducing a conductive material in the first contact via, second contact via and interconnect channel to electrically couple the first conductive contact of the first electronic component with the second conductive contact of the second electronic component.