Multi-layer electric shock protection emi filter device and manufacturing method thereof

A method for manufacturing a multi-layer electric shock protection EMI filter device, comprising steps of:

• forming a first dielectric material layer ceramic green sheet;
• printing a first metal layer on the upper surface of the first dielectric material layer ceramic green sheet, wherein the first metal layer includes an elongated first metal layer A and a short first metal layer B, one end of the first metal layer A and the first metal layer B are cut to be aligned with edges of the first dielectric material layer ceramic green sheet, and a gap is formed between one end and the opposite end thereof;
• providing a second dielectric material layer ceramic green sheet above the first metal layer, and ensuring that the gap of the first metal layer is filled up by a part of the second dielectric material layer ceramic green sheet;
• printing a second metal layer on the upper surface of the second dielectric material layer ceramic green sheet, wherein the second metal layer includes a short second metal layer A and an elongated second metal layer B, one end of the second metal layer A and the second metal layer B are cut to be aligned with edges of the second dielectric material layer ceramic green sheet, and a gap is formed between one end and the opposite end thereof;
• providing a third dielectric material layer ceramic green sheet above the second metal layer, and ensuring that the gap of the second metal layer is filled up by a part of the third dielectric material layer ceramic green sheet;
• printing an electric shock protection layer on the upper surface of the third dielectric material layer ceramic green sheet, wherein the electric shock protection layer is provided with two metal wires, one end of the two metal wires are cut to be aligned with edges of the third dielectric material layer ceramic green sheet respectively, and a tripping layer which is a mix of Sid;
• and glass is formed between one end and the opposite end thereof;
• providing a fourth dielectric material layer ceramic green sheet above the electric shock protection layer;
• printing a third metal layer on the upper surface of the fourth dielectric material layer ceramic green sheet, wherein the third metal layer includes an elongated third metal layer A and a short third metal layer B, one end of the third metal layer A and one end of the third metal layer B are cut to be aligned with edges of the fourth dielectric material layer ceramic green sheet respectively, and a gap is formed between one end and the opposite end thereof;
• providing a fifth dielectric material layer ceramic green sheet above the third metal layer , and ensuring that the gap of the third metal layer is filled up by a part of the fifth dielectric material layer ceramic green sheet;
• printing a fourth metal layer on the upper surface of the fifth dielectric material layer ceramic green sheet, wherein the fourth metal layer includes a short fourth metal layer A and an elongated fourth metal layer B, one end of the fourth metal layer A and one end of the fourth metal layer B are cut to be aligned with edges of the fifth dielectric material layer ceramic green sheet respectively, and a gap is formed between one end and the opposite end thereof;
• providing a sixth dielectric material layer ceramic green sheet above the fourth metal layer, and ensuring that the gap of the fourth metal layer is filled up by a part of the sixth dielectric material layer ceramic green sheet;
• then, performing a low temperature cofire process to make the overall sintered into a whole, and sintering the tripping layer of the electric shock protection layer to be a compound structure of a SiC body and an air gap;
• and
• finally, forming a first end electrode and a second end electrode respectively on overall sides.