Method of Manufacturing a Semiconductor Device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYung-Jean Lu, Ming-Fa Chen, Chen-Shien Chen, Jao Sheng Huang
Life of this patent
Estimating the term…
Abstract
A system and method for a semiconductor wafer carrier is disclosed. An embodiment comprises a semiconductor wafer carrier wherein conductive dopants are implanted into the carrier in order to amplify the coulombic forces between an electrostatic chuck and the carrier to compensate for reduced forces that result from thinner semiconductor wafers. Another embodiment forms conductive layers and vias within the carrier instead of implanting conductive dopants.
Claims20
A method of manufacturing a semiconductor device comprising:
- providing a semiconductor wafer comprising a substrate and one or more through-substrate vias extending into a part of the substrate;
- providing a carrier comprising one or more conductive vias;
- attaching the semiconductor wafer to the carrier;
- and
- removing the semiconductor wafer from the carrier.
A method of manufacturing a semiconductor device, the method comprising:
- forming a conductive via within a carrier;
- attaching a semiconductor substrate to the carrier, wherein one or more conductive vias extend into the semiconductor substrate;
- and
- removing the carrier from the semiconductor substrate.
A method comprising:
- providing a semiconductor wafer comprising a substrate;
- forming one or more through-substrate vias extending into a part of the substrate;
- providing a carrier;
- forming a conductive via within the carrier;
- attaching the semiconductor wafer to the carrier;
- and
- removing the semiconductor wafer from the carrier.
Dependencies are inferred from the claim text.