Chemical mechanical polishing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorKyutae PARK
Life of this patent
Estimating the term…
Abstract
Disclosed is a chemical mechanical polishing apparatus. The chemical mechanical polishing apparatus comprises a lower base, a platen configured to rotate and provided on a top surface of the lower base, a polishing pad on the platen; and at least one slurry supply device that is disposed adjacent to the polishing pad and supplies a slurry to the polishing pad. The slurry supply device comprises a capillary nozzle that is disposed over the polishing pad and includes a pin-type conductive tip therein, a slurry supply unit that supplies the slurry into the capillary nozzle, and a voltage supply unit that applies a voltage to the pin-type conductive tip.
Claims20
A chemical mechanical polishing apparatus, comprising:
- a lower base;
- a platen provided on a top surface of the lower base and configured to rotate;
- a polishing pad on the platen;
- and
- at least one slurry supply device adjacent to the polishing pad,
- wherein the at least one slurry supply device includes:
- a capillary nozzle over the polishing pad, the capillary nozzle including a pin-type conductive tip therein;
- a slurry supply unit configured to supply a slurry into the capillary nozzle;
- and
- a voltage supply unit configured to apply a voltage to the pin-type conductive tip.
A chemical mechanical polishing apparatus, comprising:
- a lower base;
- a platen provided on a top surface of the lower base and configured to rotate;
- a polishing pad on the platen;
- and
- at least one slurry supply device adjacent to the polishing pad
- wherein the at least one slurry supply device includes;
- a capillary nozzle over and spaced apart from the polishing pad;
- a slurry supply unit configured to supply the slurry into the capillary nozzle;
- and
- a voltage supply unit configured to apply a voltage to the capillary nozzle,
- wherein the voltage supply unit is configured to apply the capillary nozzle, and the capillary nozzle is configured to electro-hydrodynamically spray the slurry out of the capillary nozzle.
A slurry supply device for supplying slurry onto a polishing pad comprising:
- a capillary nozzle including a pin-type conductive tip and a jetting hole, the jetting hole over and spaced apart from the polishing pad by between 2 cm to 9 cm;
- a slurry supply unit configured to supply slurry into the capillary nozzle;
- and
- a voltage supply unit configured to apply a voltage to the pin-type conductive tip.
Dependencies are inferred from the claim text.