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US 2018/0006614 A1Published application
Flip chip circuit
AssigneeNXP B.V.
InventorsGian Hoogzaad, Tony Vanhoucke, Mark Pieter van der Heijden
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Abstract
A flip chip circuit comprising: a semiconductor substrate; a power amplifier provided on the semiconductor substrate; and a metal pad configured to receive an electrically conductive bump for connecting the flip chip to external circuitry. At least a portion of the power amplifier is positioned directly between the metal pad and the semiconductor substrate.
Claims15
A flip chip circuit comprising:
- a semiconductor substrate;
- a power amplifier provided on the semiconductor substrate;
- a metal pad configured to receive an electrically conductive bump for connecting the flip chip to external circuitry;
- wherein at least a portion of the power amplifier is positioned directly between the metal pad and the semiconductor substrate.
1 more element
Dependencies are inferred from the claim text.