Multi-axis flattening tool and method
AssigneeSunPower Corporation
InventorRichard Hamilton Sewell
Life of this patent
Estimating the term…
Abstract
A multi-axis flattening tool and method are described. In an example, the multi-axis flattening tool includes a support structure to constrain a bowed wafer along a support perimeter, and a pair of flattening structures independently movable relative to the support structure. For example, a first flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a first plane, and a second flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a second plane orthogonal to the first plane. The multi-axis bending of the wafer may flatten the wafer.
Claims20
A multi-axis flattening tool, comprising:
- a support structure including a plurality of support grippers arranged along a support perimeter on a transverse plane;
- a first flattening structure coupled to the support structure by a first actuator, wherein the first flattening structure includes a plurality of first grippers arranged within the support perimeter about a first axial plane orthogonal to the transverse plane;
- and
- a second flattening structure coupled to the support structure by a second actuator, wherein the second flattening structure includes a plurality of second grippers arranged within the support perimeter about a second axial plane orthogonal to the transverse plane and the first axial plane.
A multi-axis flattening tool, comprising:
- a set of support grippers arranged along a support perimeter on a transverse plane;
- a first set of grippers arranged within the support perimeter about a first axial plane, wherein the first axial plane is orthogonal to the transverse plane;
- a second set of grippers arranged within the support perimeter about a second axial plane, wherein the second axial plane is orthogonal to the transverse plane and the first axial plane;
- and
- a plurality of actuators, each actuator coupled to a respective subset of the first set or the second set of grippers, and both actuators coupled to a common subset of the first set and the second set of grippers.
A method, comprising:
- pressing a plurality of support grippers of a multi-axis flattening tool against a wafer, wherein the support grippers press against the wafer along a support perimeter on a transverse plane;
- attaching a plurality of first grippers of the multi-axis flattening tool to the wafer within the support perimeter;
- attaching a plurality of second grippers of the multi-axis flattening tool to the wafer within the support perimeter;
- moving the first grippers in an axial direction to bow the wafer about a first axial plane orthogonal to the transverse plane;
- and
- moving the second grippers in the axial direction to bow the wafer about a second axial plane orthogonal to the transverse plane and the first axial plane.
Dependencies are inferred from the claim text.