Chamber filler kit for dielectric etch chamber

A chamber filler kit for balancing electric fields in a dielectric etch chamber, wherein the dielectric etch chamber comprises a partially cylindrical chamber body with a partial cylindrical bore with a transport aperture and a bias housing aperture opposite the transport aperture, and a bias housing wall adjacent to the bias housing aperture, the chamber filler kit comprising:

• a transport module filler comprising:
• an electrical conductive body;
• an etch resistant surface, wherein the etch resistant surface comprises an inner curved surface, which matches the partial cylindrical bore;
• and
• a wafer transport aperture for allowing a wafer and a robotic arm to pass into the partial cylindrical bore, wherein the transport module filler fits into the transport aperture and fills at least half of a volume of the transport aperture;
• a transport module sealer plate adapted to be mechanically and electrically connected to the partially cylindrical chamber body and the transport module filler comprising a seal for creating a seal around the transport aperture;
• and
• a bias housing filler adapted to be mechanically and electrically connected to the bias housing wall, comprising:
• a conductive body;
• and
• an etch resistant surface, wherein the bias housing filler fills at least 75% of a volume of the bias housing aperture, and wherein the etch resistant surface comprises a curved surface, which matches the partial cylindrical bore.