US 2018/0005817 A1 · APPARATUS AND METHOD FOR TREATING SUBSTRATE

Abstract

Disclosed are an apparatus and a method for liquid-treating a substrate. The method for liquid-treating a substrate includes a first treatment liquid supplying operation of supplying a first treatment liquid to a treatment location of the substrate, and a wetting operation of, after the first treatment liquid supplying operation, supplying a wetting liquid onto the substrate, wherein the wetting operation includes a simultaneous supply operation of supplying the wetting liquid to the first location while the first treatment liquid is supplied, and wherein the first location is a location deviating from the treatment location. Accordingly, the surface of the substrate may be prevented from being dried while the treatment liquid is converted to a wetting liquid.

Claims16

Dependent claims

An apparatus for liquid-treating a substrate, the apparatus comprising:

a treatment container having a treatment space in the interior thereof;
a substrate support unit supporting the substrate in the treatment space;
a fixed nozzle unit fixedly installed in the treatment container;
and
a movable nozzle unit being movable to a location facing the treatment space and including a first movable nozzle configured to supply a first treatment liquid onto the substrate supported by the substrate support unit,
wherein the fixed nozzle unit includes:
a first fixed nozzle configured to supply a wetting liquid to a first location of the substrate supported by the substrate support unit;
and
a second fixed nozzle configured to supply the wetting liquid to a second location of the substrate supported by the substrate support unit, and
wherein the first location is a location that is farther from the center of the substrate than the second location.

7 more elements

Dependencies are inferred from the claim text.

Apparatus and method for treating substrate

Life of this patent

Apparatus and method for treating substrate

Life of this patent

Abstract

Claims16