Method and apparatus for use in laser shock peening

A system comprising:

• a diode-pumped solid-state laser (DPSSL) oscillator configured to generate a pulsed laser beam having a first set of laser beam characteristics;
• a modulator configured to modify the pulsed laser beam to generate a modulated pulsed laser beam, wherein the modulated pulsed laser beam has a second set of laser beam characteristics;
• a multi-stage amplifier configured to modify the modulated pulsed laser beam to generate a first pulsed laser beam, wherein the first pulsed laser beam has a third set of laser beam characteristics, and further configured to modify the first pulse laser beam to generate a second pulsed laser beam, wherein the second pulsed laser beam has a fourth set of laser beam characteristics;
• and
• a beam delivery system configured to deliver the second pulsed laser beam to a target part to laser shock peen the target part.

A method comprising:

• generating a pulsed laser beam having a first set of laser beam characteristics;
• modifying the pulsed laser beam to generate a first pulsed laser beam, wherein the first pulsed laser beam has a second set of laser beam characteristics,
• modifying the first pulse laser beam to generate a second pulsed laser beam, wherein the second pulsed laser beam has a third set of laser beam characteristics;
• and
• delivering the second pulsed laser beam to a target part to laser shock peen the target part.