Oled device encapsulation structures, oled devices, and display panels

Abstract

The present disclosure relates to a package structure of organic light emitting diode (OLED) components. The package structure includes an OLED body and an encapsulation layer having an organic layer, a protecting layer, a blocking layer, and a stressed layer. A first curved-surface area is formed on the organic layer, and the protecting layer, the blocking layer, and the stressed layer are stacked on the organic layer in sequence. The protecting layer, the blocking layer, and the stressed layer are respectively formed with a second curved-surface area. The second curved-surface area is stacked on the first curved-surface area and is overlapped with the first curved-surface area, and the second curved-surface area and the first curved-surface area form a folded area of the encapsulation layer. The present disclosure also relates to one OLED component and a display panel.

Dependencies are inferred from the claim text.