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US 2017/0373114 A1Published application
Stacked Semiconductor Chip RGBZ Sensor
AssigneeGoogle Inc.
InventorChung Chun Wan
Life of this patent
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Abstract
An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.
Claims21
(canceled)
A method comprising:
- forming a backside illumination pixel array including (i) pixels of a first type, and, (ii) for each pixel, a light guide structure between the pixel and a front side surface of the backside illumination pixel array;
- forming a front side illumination pixel array including (i) pixels of a second type, and, (ii) for each pixel, a light guide structure between the pixel and a front side surface of the front side pixel array;
- and
- stacking the backside illumination pixel array on the front side illumination pixel array.
1 more element
Dependencies are inferred from the claim text.