Film product, film packages and package modules using the same

A film package, comprising:

• a film substrate having a first surface and a second surface opposite the first surface, the film substrate having a length in a first direction and a width in a second direction perpendicular to the first direction;
• a first plurality of pads on the second surface, and the first plurality of pads arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction;
• and
• a semiconductor chip on the first surface;
• a first connection structure electrically connecting the semiconductor chip to the first plurality of pads, the first connection structure including a plurality of first vias extending from the first to the second surface, each of the plurality of first vias being electrically connected to a respective one of the first plurality of pads;
• and
• a first plurality of conductive lines on the first surface, each of the first plurality of conductive lines extending from a first edge of the film substrate to a respective one of the plurality of first vias such that the first plurality of conductive lines have different lengths.