Semiconductor device and a method of manufacturing the same
AssigneeFuji Electric Co., Ltd.
InventorsYuta TAMAI, Fumihiko MOMOSE
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AssigneeFuji Electric Co., Ltd.
InventorsYuta TAMAI, Fumihiko MOMOSE
Estimating the term…
A semiconductor device has a U terminal with an internal joint portion at one end that is joined to a circuit board, an intermediate portion that is embedded in a case, and an external joint portion at another end that is exposed from the case, the U terminal being provided with a shock absorbing portion that is positioned between an inner surface of the case and the internal joint portion and absorbing stress that acts upon the internal joint portion. Due to the presence of the shock absorbing portion, even when the entire semiconductor device deforms or there is local deformation such that stress becomes concentrated at the joined surfaces of the internal joint portion and the circuit board, the stress is absorbed by the shock absorbing portion.
A semiconductor device comprising:
A method of manufacturing a semiconductor device comprising:
Dependencies are inferred from the claim text.