Method and Structure for Mandrel and Spacer Patterning
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Che Tseng, Chen-Yuan Wang, Wilson Hsieh, Yi-Hung Lin, Chung-Li Huang
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Che Tseng, Chen-Yuan Wang, Wilson Hsieh, Yi-Hung Lin, Chung-Li Huang
Estimating the term…
An IC manufacturing method includes forming first mandrels and second mandrels over a substrate; and forming first spacers on sidewalls of the first mandrels and second spacers on sidewalls of the second mandrels. Each of the first and second spacers has a loop structure with two curvy portions connected by two lines. The method further includes removing the first and second mandrels; and removing the curvy portions from each of the first spacers without removing the curvy portions from the second spacers. The second spacers are used for monitoring variations of the IC fabrication processes.
A method, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.