Process for fabricating a transistor structure including a plugging step

Abstract

A process for fabricating a transistor structure produced sequentially, comprises at least one string of the following steps: producing at least one first transistor from a first semiconductor layer possibly made of silicon; encapsulating at least the first transistor with at least one first dielectric layer defining a first assembly; bonding a second dielectric layer located on the surface of a second semiconductor layer possibly made of silicon, to the first dielectric layer; depositing a planarizing material layer on the surface of the second semiconductor layer; selectively etching the planarizing material layer, to the second semiconductor layer; and producing at least one second transistor from the second semiconductor layer.

Dependencies are inferred from the claim text.