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US 2017/0372952 A1Published application
Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures
AssigneeInfineon Technologies AG
InventorsAlbert Birner, Tobias Herzig
Life of this patent
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Abstract
In an embodiment, a substrate includes semiconductor material and a conductive via. The conductive via includes a via in the substrate, a conductive plug filling a first portion of the via and a conductive liner layer that lines side walls of a second portion of the via and is electrically coupled to the conductive plug. The conductive liner layer and the conductive plug have different microstructures.
Claims28
A substrate, comprising:
- a semiconductor material;
- and
- a conductive via,
- wherein the conductive via comprises a via in the substrate, a conductive plug filling a first portion of the via and a conductive liner layer lining side walls of a second portion of the via and electrically coupled to the conductive plug, wherein the conductive liner layer and the conductive plug have different microstructures.
1 more element
A method, comprising:
- forming a first conductive layer in a first portion of an opening in a semiconductor substrate using first deposition parameters such that the first conductive layer fills the opening in the first portion;
- and
- forming a second conductive layer on the first conductive layer in a second portion of the opening using second deposition parameters such that the second conductive layer bounds a first gap in the second portion,
- wherein the first deposition parameters are selected to favour growth of the first conductive layer in a vertical direction with respect to a major surface of the semiconductor substrate and suppress growth in lateral directions and on a front surface of the semiconductor substrate,
- wherein the second deposition parameters are selected to favour conformal growth of the second conductive layer in a lateral direction with respect to the major surface of the semiconductor substrate,
- wherein the first conductive layer and the second conductive layer are formed by electroplating.
3 more elements
19-20. (canceled)
Dependencies are inferred from the claim text.