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US 2017/0372933 A1Published application
Apparatus and method for treating substrate
AssigneeSemes Co., Ltd.
InventorDUK SIK KIM
Life of this patent
Estimating the term…
Abstract
A substrate treating apparatus comprises: an alignment unit for aligning a substrate placed in a support unit in position; and a teaching unit for setting a transfer position for transferring the substrate onto the support unit of the transfer unit, wherein the teaching unit correcting a transfer position of the transfer unit based on a difference value between a first position of a substrate placed on a hand of the transfer unit when the transfer unit is transferring the substrate and a second position of a substrate placed on the hand of the transfer unit that picks up the substrate aligned to the support unit in position.
Claims17
a substrate treating apparatus comprising:
- a support unit for supporting the substrate;
- an alignment unit for aligning the substrate placed in the support unit in position;
- a transfer unit having a hand on which the substrate is placed and a position sensor for measuring the position of the substrate on the hand, and transferring the substrate to the support unit;
- and
- a teaching unit for setting a transfer position for transferring the substrate onto the support unit of the transfer unit,
- wherein the teaching unit comprising:
- a first position measuring step for measuring a first position of the substrate placed on the hand using the position sensor;
- a substrate seating step for seating the substrate placed on the hand on the support unit;
- an alignment step of aligning the substrate placed on the support unit in position;
- a substrate pickup step for picking up the substrate placed on the support unit from the support unit using the transfer unit;
- a second position measuring step for measuring a second position of the substrate placed on the hand using the position sensor;
- an offset determination step for determining a difference value between the first position and the second position;
- and
- a position correcting step for correcting a transfer position of the transfer unit based on the difference value;
- are sequentially performed to set the transfer position of the transfer unit.
12 more elements
a substrate treating apparatus comprising:
- a support unit for supporting the substrate and rotating the substrate;
- a transfer unit having a hand on which the substrate is placed and a position sensor for measuring the position of the substrate on the hand, and transferring the substrate to the support unit;
- and
- a teaching unit for setting a transfer position for transferring the substrate onto the support unit of the transfer unit,
- wherein the teaching unit comprising:
- a third position measuring step for measuring a third position of the substrate placed on the hand;
- a substrate seating step for seating the substrate placed on the hand on the support unit;
- a rotating step for rotating the substrate at a predetermined angle;
- a substrate pickup step for picking up the substrate placed on the support unit from the support unit using the transfer unit;
- a fourth position measuring step for measuring a fourth position of the substrate placed on the hand;
- an offset determination step for using a measured value of the third position and the fourth position in the third position measuring step and the fourth position measuring step to determine a difference value between the third position and a position of the substrate picked up by the hand when the substrate is placed in the support unit in position;
- and
- a position correcting step for correcting a transfer position of the transfer unit based on the difference value;
- are sequentially performed to set the transfer position of the transfer unit.
11 more elements
a substrate treating method comprising:
- a first position measuring step for measuring a first position of a substrate placed on a hand of a transfer unit for transferring a substrate to a support unit for supporting the substrate;
- a substrate seating step for seating the substrate placed on the hand on the support unit;
- an alignment step of aligning the substrate placed on the support unit in position;
- a substrate pickup step for picking up the substrate placed on the support unit from the support unit using the transfer unit;
- a second position measuring step for measuring a second position of the substrate placed on the hand;
- an offset determination step for determining a difference value between the first position and the second position;
- and
- a position correcting step for correcting a transfer position of the transfer unit based on the difference value.
5 more elements
a substrate treating method comprising:
- a third position measuring step for measuring a third position of the substrate placed on the hand of a transfer unit for transferring a substrate to a support unit for supporting the substrate;
- a substrate seating step for seating the substrate placed on the hand on the support unit;
- a rotating step for rotating the substrate at a predetermined angle;
- a substrate pickup step for picking up the substrate placed on the support unit from the support unit using the transfer unit;
- a fourth position measuring step for measuring a fourth position of the substrate placed on the hand;
- an offset determination step for using a measured value of the third position and the fourth position in the third position measuring step and the fourth position measuring step to determine a difference value between the third position and a position of the substrate picked up by the hand when the substrate is placed in the support unit in position;
- and
- a position correcting step for correcting a transfer position of the transfer unit based on the difference value;
- are sequentially performed to set the transfer position of the transfer unit.
6 more elements
Dependencies are inferred from the claim text.