Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object
AssigneeDisco Corporation
InventorKoichi Shigematsu
Life of this patent
Estimating the term…
Loading patent…
AssigneeDisco Corporation
InventorKoichi Shigematsu
Estimating the term…
There is provided a cutting method for cutting a processing-target object by a cutting blade. The cutting method includes a holding step of holding the processing-target object by a holding table and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out. In the cutting step, cutting is carried out with detection of whether or not a crack in the processing-target object exists by a crack detecting unit disposed on the rear side relative to the cutting blade in a cutting progression direction in which cutting processing of the processing-target object by the cutting blade progresses.
A cutting method for cutting a processing-target object by a cutting blade, the cutting method comprising:
A cutting apparatus that cuts a processing-target object, the cutting apparatus comprising:
Dependencies are inferred from the claim text.