Support apparatus for plasma adjustment, method for adjusting plasma, and storage medium
AssigneeTokyo Electron Limited
InventorsTakafumi NOGAMI, Makoto IGARASHI
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AssigneeTokyo Electron Limited
InventorsTakafumi NOGAMI, Makoto IGARASHI
Estimating the term…
A support apparatus for plasma adjustment includes a storage part storing index value estimation data including data defining an amount of change in an index value between adjustment positions for each of the adjustment parts, the index value corresponding to electron density of plasma, an input part for inputting a measurement result of the index value obtained when plasma is generated and the adjustment positions of the adjustment parts, and a data processing part configured to estimate the index value for each of adjustment positions of the adjustment parts based on input items input to the input part and the estimation data and configured to select proper combinations of the adjustment positions of the adjustment parts based on combinations of the adjustment positions of the adjustment parts and estimated values of a plurality of index values in the circumferential direction corresponding to the respective combinations.
A support apparatus for plasma adjustment, which is used in a plasma processing apparatus in which a processing gas is plasmarized by a microwave propagated from a coaxial waveguide located above a central portion of a substrate placed in a processing container into the processing container via a flat slot antenna and a dielectric plate, plasma treatment is performed on the substrate, and a plurality of adjustment parts for adjusting an electric field distribution of the microwave installed along a circumferential direction of the processing container, comprising:
A method for adjusting plasma of a plasma processing apparatus in which a processing gas is plasmarized by a microwave propagated from a coaxial waveguide located above a central portion of a substrate placed in a processing container into the processing container via a flat slot antenna and a dielectric plate, plasma treatment is performed on the substrate, and a plurality of adjustment parts for adjusting an electric field distribution of the microwave installed along a circumferential direction of the processing container, comprising:
Dependencies are inferred from the claim text.