Capacitive fingerprint recognition module
AssigneePrimax Electronics Ltd.
InventorsYONG LIU, AI-LING HE
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Abstract
This application provides a capacitive fingerprint recognition module, including a substrate, a fingerprint recognition chip, a mold compound, a chip adhesive layer, and a cover plate. The mold compound and the fingerprint recognition chip are disposed on the substrate, and the mold compound packages the fingerprint recognition chip. The cover plate is covered on the chip adhesive layer, so that a squeezed part of the chip adhesive layer is squeezed beyond an edge of the cover plate and is exposed outside. The chip adhesive layer is selected from a non-white material, and therefore the squeezed part of the chip adhesive layer is visually hidden. By means of the configuration, a process of clearing the squeezed part of the chip adhesive layer may be omitted.
Claims6
A capacitive fingerprint recognition module, comprising:
- a substrate;
- a fingerprint recognition chip, disposed above the substrate in an adhesive manner;
- a bonding wire, wherein two ends of the bonding wire are electrically connected to the fingerprint recognition chip and the substrate, respectively;
- a mold compound, located above the substrate and packaging the fingerprint recognition chip and the bonding wire;
- a chip adhesive layer, applied on an upper surface of the mold compound, wherein the material of the chip adhesive layer is selected from a non-white material;
- and
- a cover plate, covered on the chip adhesive layer and adhered above the mold compound by using the chip adhesive layer.
Dependencies are inferred from the claim text.