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US 2017/0365810 A1Published application
Semiconductor device and method for manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsToru TAKAYAMA, Junya MARUYAMA, Yumiko OHNO
Life of this patent
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Abstract
To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.
Claims37
(canceled)
A semiconductor device comprising:
- a first support medium;
- a first adhesive material over the first support medium;
- an oxide film over the first adhesive material;
- a first transistor over the oxide film;
- a light-emitting element electrically connected to the first transistor, wherein the light-emitting element comprises a first electrode, a second electrode, and a layer comprising an organic compound between the first electrode and the second electrode;
- an organic resin over the first transistor and the light-emitting element;
- an inorganic insulating film over the organic resin;
- a capacitor over the inorganic insulating film;
- a second adhesive material over the capacitor;
- and
- a second support medium over the second adhesive material.
8 more elements
A semiconductor device comprising:
- a first plastic substrate;
- a first adhesive material over the first plastic substrate;
- an oxide film over the first adhesive material;
- a first transistor over the oxide film;
- a light-emitting element electrically connected to the first transistor, wherein the light-emitting element comprises a first electrode, a second electrode, and a layer comprising an organic compound between the first electrode and the second electrode;
- an organic resin over the first transistor and the light-emitting element;
- an inorganic insulating film over the organic resin;
- a capacitor over the inorganic insulating film;
- a second adhesive material over the capacitor;
- and
- a second plastic substrate over the second adhesive material.
8 more elements
A semiconductor device comprising:
- a first support medium;
- a first adhesive material over the first support medium;
- an oxide film over the first adhesive material;
- a first transistor over the oxide film;
- a light-emitting element electrically connected to the first transistor, wherein the light-emitting element comprises a first electrode, a second electrode, and a layer comprising an organic compound between the first electrode and the second electrode;
- an organic resin over the first transistor and the light-emitting element;
- an inorganic insulating film over the organic resin;
- a first conductive layer over the inorganic insulating film;
- an insulating layer over and in contact with the first conductive layer;
- a second conductive layer over and in contact with the insulating layer, wherein the first conductive layer and the second conductive layer overlap with each other;
- a second adhesive material over the second conductive layer;
- and
- a second support medium over the second adhesive material.
10 more elements
A semiconductor device comprising:
- a first plastic substrate;
- a first adhesive material over the first plastic substrate;
- an oxide film over the first adhesive material;
- a first transistor over the oxide film;
- a light-emitting element electrically connected to the first transistor, wherein the light-emitting element comprises a first electrode, a second electrode, and a layer comprising an organic compound between the first electrode and the second electrode;
- an organic resin over the first transistor and the light-emitting element;
- an inorganic insulating film over the organic resin;
- a first conductive layer over the inorganic insulating film;
- an insulating layer over and in contact with the first conductive layer;
- a second conductive layer over and in contact with the insulating layer, wherein the first conductive layer and the second conductive layer overlap with each other;
- a second adhesive material over the second conductive layer;
- and
- a second plastic substrate over the second adhesive material.
10 more elements
Dependencies are inferred from the claim text.