Field effect transistors with self-aligned extension portions of epitaxial active regions
AssigneeInternational Business Machines Corporation
InventorsEffendi Leobandung, Tenko Yamashita
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AssigneeInternational Business Machines Corporation
InventorsEffendi Leobandung, Tenko Yamashita
Estimating the term…
A gate structure is formed across a single crystalline semiconductor fin. An amorphizing ion implantation is performed employing the gate structure as an implantation mask to amorphize surface portions of the semiconductor fin into inverted U-shaped amorphous semiconductor portions. A gate spacer is formed around the gate structure, and the inverted U-shaped amorphous semiconductor portions are etched selective to a single crystalline portion of the semiconductor fin and the gate structure. A pair of inverted U-shaped cavities is formed underneath the gate spacer and above the remaining portion of the semiconductor fin. A doped epitaxial semiconductor material is deposited by a selective epitaxy process to form doped epitaxial active regions that include self-aligned extension portions underlying the gate spacer.
A semiconductor structure comprising:
A semiconductor structure comprising:
Dependencies are inferred from the claim text.