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US 2017/0365556 A1Published application
Electronic circuit apparatus
AssigneeMiyoshi Electronics Corporation
InventorKazuhito MORI
Life of this patent
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Abstract
There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus includes a dielectric substrate, an electronic component, a heat spreader, and a conductive via. The conductive via electrically and thermally connects the electronic component and the heat spreader. The conductive via extends from the first surface to at least an interior of the heat spreader and is in surface-contact with the heat spreader.
Claims8
An electronic circuit apparatus comprising:
- a dielectric substrate having a first surface and a second surface opposite to the first surface;
- an electronic component mounted on the first surface;
- a heat spreader bonded to the second surface via a first bonding member;
- and
- a conductive via electrically and thermally connecting the electronic component and the heat spreader, and
- a semiconductor chip electrically connected to the electronic component, the semiconductor chip being different in type from the electronic component,
- the conductive via extending from the first surface to at least an interior of the heat spreader and being in surface-contact with the heat spreader.,
- the dielectric substrate having a cavity portion extending from the first surface to the heat spreader, and
- the semiconductor chip being bonded to the heat spreader in the cavity portion via a second bonding member.
6 more elements
Dependencies are inferred from the claim text.