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US 2017/0365554 A1Published application
Polymer bonding with improved step coverage
AssigneeSkyworks Solutions, Inc.
InventorsBradley Paul Barber, Kezia Cheng
Life of this patent
Estimating the term…
Abstract
A system and method for packaging an electronic device are provided. The packaged electronic device may include a structure material having one portion with a first lateral cross-section, and at least one other portion with a second lateral cross-section, where at least one of a dimension and a shape of the second lateral cross-section is different than in the first lateral cross-section.
Claims27
A bonding structure for packaging an electronic device comprising:
- a receiving substrate having a first surface including at least one three-dimensional structure;
- and
- a layer of structure material disposed on the first surface and including a first portion and a second portion, the second portion at least partially covering the at least one three-dimensional structure, the first portion having a first lateral cross-section and the second portion having a second lateral cross-section in which at least one of a dimension and a shape of the layer of structure material is different than in the first lateral cross-section.
A transferable structure, comprising
- at least one layer of structure material having a first portion and a second portion, the first portion having a first lateral cross-section and the second portion having a second lateral cross-section in which at least one of a dimension and a shape of the layer of structure material is different than in the first lateral cross-section.
A method of forming a bonding structure for a packaged electronic device, comprising:
- depositing a layer of structure material onto at least a portion of a surface of a first substrate;
- masking the layer of structure material to define a masked region and an unmasked region of the structure material, the unmasked region of the structure material defined by a first portion with a first cross-section and a second portion with a second cross-section, the first cross-section and the second cross-section oriented horizontally and at least one of a dimension and a shape of the second cross-section is different than a dimension and shape of the first cross-section;
- exposing the masked and unmasked regions of the structure material to a source of light to at least partially cure the unmasked region;
- and
- removing the masked region of the structure material.
2 more elements
Dependencies are inferred from the claim text.