Semiconductor device fabricated by flux-free soldering

A method, comprising:

• placing a first semiconductor chip on a carrier with the first main surface of the first semiconductor chip facing the carrier, wherein a first layer of soft solder material is provided between the first main surface and the carrier and heat is applied during placing so that a temperature at the first layer of soft solder material is equal to or higher than a melting temperature of the first layer of soft solder material;
• placing a contact clip comprising a first contact area on the first semiconductor chip with the first contact area facing the second main surface of the first semiconductor chip, wherein a second layer of soft solder material is provided between the first contact area and the second main surface and heat is applied during placing so that a temperature at the second layer of soft solder material is equal to or higher than a melting temperature of the second layer of soft solder material;
• and thereafter
• cooling the first and second layers of soft solder material to solidify the soft solder materials.